Surface Mount Process Carriers are engineered to completely fixture a circuit board during the overall assembly process. These carriers are made of high-temperature semi-conductive composite materials, used from start to finish in the assembly process.
Surface Mount Process Carriers have many features and benefits which enhance automated assembly and increase production by:
Reducing set-up time.
Eliminating unnecessary PCB board handling by operators.
Minimizing board warping.
Eliminate expensive hand masking and labour costs.
Standardizing process repetition.
Machine parameters.
Minimizing soldering defects.
Surface Mount Process Carriers are made of composite materials with advantageous features such as:
High-temperature compatibility to endure repeated cycles through the re-flow.
Material stability to ensure board alignment is consistent.
Chemical resistance for increased durability through harsh cleaning process.
Our Clients Say...
"Stentech service and customer focus are unparalleled.
Very fast turnarounds, even when rushed, and prices that are very competitive.Your ability to solve our cutting plate problems (CNC milling services) was impressive. Thank you for being so courteous even when we are often very demanding."
- R. Doucet, Process Engineer, CAE Inc.
"Stentech has a history of quick turnaround and dependable quality. They have always been helpful with diligent and professional service on special requests such as rush orders, custom stencil framing, reframing, and special designs for glue printing or pin through paste applications. We love doing business with Stentech."
- Christian Morining. M.Sc.A., President, Optimont inc.
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