The NanoSlic® stencil is the most advanced solder paste stencil available today. The coating was developed by Florida CirTech chemists to achieve a durable, paste repelling coating that improves stencil printing significantly. Building on the proven benefits of the Slic™ stencil, advanced chemistry is used to impart a highly Hydrophobic & Oleophobic surface to the apertures and underside of the stencil. This non-stick surface resists solder paste build-up, significantly reducing the need for cleaning cycles. The Nano coating is permanently bonded to and conforms to aperture walls regardless of size or geometry. The NanoSlic® stencil improves paste release, enabling high yield printing at low area SARs (surface area ratios). NanoSlic® has a robust surface that stands up to repeated cleaning.
NanoSlic Gold is applied to the aperture walls and under-side of the stencil and provides a hydrophobic and oleophobic surface. This prevents solder paste from adhering to the stencil where this coating is applied. The benefits of this include reduced bridging, minimized underside cleaning, and improved solder paste release. Solder paste volumes are increased dramatically when NanoSlic Gold is used.
NanoSlic Gold is a thermally cured polymer which is thicker than conventional Nano-coatings. The most common Nano-coatings are wiped onto the stencil. The NanoSlic Gold coating is several microns thick. It is a very durable and chemically resistant coating.
The aperture length and width are reduced by the coating thickness, but the stencil thickness is increased by the NanoSlic Gold thickness. The net change in aperture volume is roughly 5% and is slightly dependent upon aperture size. NanoSlic Gold does however increase the printed paste volume due to superior paste transfer efficiency. This more than compensates for the slight reduction in aperture size.
The aperture length and width are reduced by the coating thickness, but the stencil thickness is increased by the NanoSlic Gold thickness. The net change in aperture volume is roughly 5% and is slightly dependent upon aperture size. NanoSlic Gold does however increase the printed paste volume due to superior paste transfer efficiency. This more than compensates for the slight reduction in aperture size.
Most cleaning chemistries are compatible with NanoSlic Gold. However, higher pH (> 11) cleaning chemicals can damage the coating over time. A list of recommended cleaning chemicals is available in the technical data sheet.
The coating is non-ionic and chemically inert, and becomes part of the flux residue around the solder joint. If water soluble solder paste is used, the coating would easily wash away with the flux. If no clean solder paste is used, then the coating becomes an inert part of the flux residue.
Yes, NanoSlic Gold is easy to see on the stencil, so you know it is there and functional. The wipe on coatings are typically invisible, and consequently it is hard to tell when they quit working.
Yes and No. The stencil must be completely cleaned of all solder paste residues, but we recommend applying to a freshly cut and cleaned stencil to ensure a proper bond.
Yes, NanoSlic Gold coating increases the lead time by one day.
The NanoSlic® stencil is the most advanced solder paste stencil available today. The coating was developed by Florida CirTech chemists to achieve a durable, paste repelling coating that improves stencil printing significantly. Building on the proven benefits of the Slic™ stencil, advanced chemistry is used to impart a highly Hydrophobic & Oleophobic surface to the apertures and underside of the stencil. This non-stick surface resists solder paste build-up, significantly reducing the need for cleaning cycles. The Nano coating is permanently bonded to and conforms to aperture walls regardless of size or geometry. The NanoSlic® stencil improves paste release, enabling high yield printing at low area SARs (surface area ratios). NanoSlic® has a robust surface that stands up to repeated cleaning.
NanoSlic Gold is applied to the aperture walls and under-side of the stencil and provides a hydrophobic and oleophobic surface. This prevents solder paste from adhering to the stencil where this coating is applied. The benefits of this include reduced bridging, minimized underside cleaning, and improved solder paste release. Solder paste volumes are increased dramatically when NanoSlic Gold is used.
NanoSlic Gold is a thermally cured polymer which is thicker than conventional Nano-coatings. The most common Nano-coatings are wiped onto the stencil. The NanoSlic Gold coating is several microns thick. It is a very durable and chemically resistant coating.
The aperture length and width are reduced by the coating thickness, but the stencil thickness is increased by the NanoSlic Gold thickness. The net change in aperture volume is roughly 5% and is slightly dependent upon aperture size. NanoSlic Gold does however increase the printed paste volume due to superior paste transfer efficiency. This more than compensates for the slight reduction in aperture size.
The aperture length and width are reduced by the coating thickness, but the stencil thickness is increased by the NanoSlic Gold thickness. The net change in aperture volume is roughly 5% and is slightly dependent upon aperture size. NanoSlic Gold does however increase the printed paste volume due to superior paste transfer efficiency. This more than compensates for the slight reduction in aperture size.
Most cleaning chemistries are compatible with NanoSlic Gold. However, higher pH (> 11) cleaning chemicals can damage the coating over time. A list of recommended cleaning chemicals is available in the technical data sheet.
The coating is non-ionic and chemically inert, and becomes part of the flux residue around the solder joint. If water soluble solder paste is used, the coating would easily wash away with the flux. If no clean solder paste is used, then the coating becomes an inert part of the flux residue.
Yes, NanoSlic Gold is easy to see on the stencil, so you know it is there and functional. The wipe on coatings are typically invisible, and consequently it is hard to tell when they quit working.
Yes and No. The stencil must be completely cleaned of all solder paste residues, but we recommend applying to a freshly cut and cleaned stencil to ensure a proper bond.
