StenTech has the technical ability to manufacture step stencils in both single and dual process. Today's complex PCBs with their various components require different solder paste volumes. By using various foil thicknesses on the same stencil, this allows the ability to control solder paste deposit in fine pitch areas while printing sufficient solder on coarse pitch areas.
Steps are typically chem-etched on the stencil foil before laser cutting the aperture. Steps can also be achieved on electroformed stencil.
Step stencils provide optimum solder paste volume control
Step stencil can eliminate two print processes in some cases (when some components on the same board need higher paste height/volume compared with other areas)
Single step stencil can replace multiple stencils (using step process we can have multiple images at different thickness on same stencil)
Stencils with relief pocket-step in the area of protrusions will solve the problem of gasketing, paste smearing and risk of electrical short
Multiple steps can be achieved including step on squeegee side and relief on board side on the same stencil