Let us Revolutionize physical vapor deposition

Exclusive Cutting-Edge physical vapor deposition Surface Treatment

We are proud to present our latest innovation in stencil coating technology – the all new StenTech BluPrint™ PVD (Physical Vapor Deposited) Surface Treatment. Engineered to elevate the Surface Mount Technology (SMT) processes, this advanced coating offers a comprehensive set of benefits that collectively contribute to improved stencil performance, longevity, and the overall quality of the SMT assembly process streamlining production.

Award winning StenTech BluPrint™ eliminates the need for frequent replacements and ensures a longer lifespan for the stencil, ultimately reducing maintenance and replacement costs associated with traditional coatings while dramatically enhancing overall performance.

Revolutionary process

StenTech BluPrint™ PVD (Physical Vapor Deposited) Surface Treatment represents a ground breaking technique for applying thin material films onto a substrate. This innovative process involves introducing chemical precursors into a reactor chamber, where they undergo chemical reactions and solidify as a deposited material on the substrate’s surface.

The continuous drive to reduce component sizes and circuit boards poses a challenge for solder paste printing with laser-cut stainless-steel stencils. Laser technology advancements align with coating finish improvements for these stencils. StenTech’s BluPrint™ PVD is meticulously designed to be the top choice in North America for meeting the evolving requirements of the semiconductor and EMS industry

FEATURES

StenTech BluPrint™ is the most sophisticated stencil surface treatment available and exclusive to StenTech.

Ultimate thickness consistency

Virtually indestructible

StenTech BluPrint™ offers consistently repeatable processing without variation, providing a virtually indestructible coating that remains resilient without degradation and ensures uniform printing, with the only variation being the area ratio, while each aperture remains identical.

Enhanced performance

The StenTech BluPrint™ process begins with plasma polishing, creating a smoother, high-gloss surface with improved corrosion resistance. This process polishes both the stencil foil surface and aperture sidewalls, resulting in smoother sidewalls as a base for the subsequent coating. StenTech’s BluPrint™ PVD Surface Treatment is then applied at a thickness approximately 1000 times thinner than current alternatives, ranging from 3-5 micrometers compared to 3 nanometers.

The absolute truest form of Nano coating at the particle level

In the StenTech BluPrint™ PVD process, the wafer is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. This process involves rotating “Targets” or “Precursors,” made from special materials, inside a chamber with stencils for coating. When heat and vacuum are applied, the materials undergo oxidation, vaporize, and then redeposit onto the stencil foil. These vapor-deposited materials form layers of color and coatings, resulting in a unique hydrophobic and oleophobic coating.

This process is 100% automated, load and push start, finished in 45 min fully cured and ready.
Processed under vacuum, this ensures impurities burn off.
1 thickness, surface, knee of the apps and sidewalls of the apps.
Is not susceptible to the geometry changes as liquid sprayed on would be.
Cured at very high heat >800F the materials are baked into the surface.
10X harder than Teflon
1,000 times thinner than Advanced Nano and Nano Slick coatings
Contact angle is almost 109 degrees, super hydrophobic

01 UNIFORM COATING THICKNESS

StenTech BluPrint™ PVD ensures a uniform and conformal 1 atom thick coating, providing consistent thickness across complex geometries of SMT stencils. This uniformity is crucial for achieving precise and reliable solder paste deposition during the printing process.

02ENHANCED DURABILITY

StenTech BluPrint™ PVD coating can significantly improve the durability and wear resistance of SMT stencils. This is important in high-volume production environments where stencils are subjected to repeated use, reducing the need for frequent replacements and maintenance.

03HIGH THERMAL STABILITY

StenTech BluPrint™ PVD coating often exhibit excellent thermal stability, making them suitable for applications involving elevated temperatures during the soldering process. This stability helps maintain stencil integrity and performance under demanding manufacturing conditions.

04CHEMICAL INERTNESS

The chemical inertness of StenTech BluPrint™ PVD coating makes them resistant to reactions with solder paste and other process chemicals. This resistance contributes to the longevity of the stencil and ensures consistent performance over time.

05ANTI-STICTION PROPERTIES

StenTech BluPrint™ PVD coating can provide anti-stiction properties, reducing the likelihood of solder paste sticking to the stencil. This is particularly important for preventing defects such as solder bridging, ensuring clean and accurate paste transfer onto PCBs.

06SMOOTH SURFACE FINISH

StenTech BluPrint™ PVD coating typically results in a smooth surface finish on the stencil. A smooth surface minimizes friction during the printing process, facilitating better release of solder paste and improving the overall quality of printed solder joints.

07CUSTOMIZABLE PROPERTIES

StenTech BluPrint™ PVD processes allow for the customization of coating properties such as thickness, hardness, and composition. This flexibility enables manufacturers to tailor the coating to specific requirements, optimizing stencil performance for diverse applications.

08CONSISTENT PRINT QUALITY

StenTech BluPrint™ The combination of uniform coating thickness, durability, and other properties ensures consistent print quality over multiple production cycles. This is essential for achieving high-yield and reliable SMT assembly.

Comparison chart

Good

Genaric ceramic coatings (competitors coating)

Reduced bridging
Underside cleaning
Increased transfer effeciency
Hydropobic, Oleophobic & Fluxophobic
Better depodits
Longer cure times
Degradation with some cleaners
Can fractures like glass

Better

StenTech Advances Nano ™

Ready for use 5 min after coating
Can be delivered and used same day
Reduced bridging
Reduced underside cleaning
Increased transfer efficiency
Improved Yield:
- Transfer of solder paste (volume)
- Brick formation / integrity of the design
Increase ROI
Thermally cured
Very thin coating, 2-3 microns
Low Surface Energy
Hydrophobic, Oleophobic & Fluxophobic

Best

StenTech BluePrint ™

Ready for use 45 min after coating
Can be delivered and used same day
Reduced bridging
Reduced underside cleaning
Increased transfer efficiency- compared to non-coated
Improved Yield:
- Transfer of solder paste (volume)
- Brick formation / integrity of the design
Increase ROI
< +50,000 prints off one stencil
10X harder than Teflon
1000 times thinner than Advanced Nano <100nm
No thickness variation on all coated surfaces.
Consistent deposits of solder paste
Reduced Rework
No fall off- Less cleaning
No degradation from Cleaners
Contact angle is almost 109 degrees
Super hydrophobic
Processed under vacuum, this ensures impurities burn off and a perfect environment

StenTech BluPrint

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Exclusive Cutting-Edge physical vapor deposition Surface Treatment

Revolutionary process