SMT Solder Paste Stencils

StenTech has the technical ability to manufacture step stencils in both single and dual process. Today's complex PCBs with their various components require different solder paste volumes. By using various foil thicknesses on the same stencil, this allows the ability to control solder paste deposit in fine pitch areas while printing sufficient solder on coarse pitch areas.

Steps are typically chem-etched on the stencil foil before laser cutting the aperture. Steps can also be achieved on electroformed stencil.

Get a quote

Solder Paste Step Stencils
  • Step stencils provide optimum solder paste volume control
  • Step stencil can eliminate two print processes in some cases (when some components on the same board need higher paste height/volume compared with other areas)
  • Single step stencil can replace multiple stencils (using step process we can have multiple images at different thickness on same stencil)
  • Stencils with relief pocket-step in the area of protrusions will solve the problem of gasketing, paste smearing and risk of electrical short
  • Multiple steps can be achieved including step on squeegee side and relief on board side on the same stencil

Related Item

High Definition Print Stencils (HDP)

StenTech now offers the latest technology with our savvy High Definition Print stencils. These stencils are the answer to smaller component issues and offer improved solder paste release.

  • Food additive processing
  • Pharmaceutical pill coating
  • Protein spray drying
  • Cereal drying
  • Grain
  • Flour milling
  • Animal vitamins
company background

“StenTech has a history of quick turnaround and dependable quality. They have always been helpful with diligent and professional service on special requests such as rush orders, custom stencil framing, reframing, and special designs for glue printing or pin through paste applications. We love doing business with StenTech.”

stentech Logo