What is Advanced Nano Coating?
StenTech's Advanced Nano coating grants the stencil remarkable anti-adhesion properties, preventing solder flux from sticking to it. Utilizing a specialized 1-2 um hardened nano coating, StenTech's Advanced Nano stencil boasts a permanent hydrophobic layer that repels solder flux. Consequently, this innovative feature facilitates enhanced paste transfer during printing processes, leading to improved efficiency and precision in electronic manufacturing.
Nano coating is a polymer that is sprayed inside a chamber and heat treated. This permanent hydrophobic coating repels solder paste, resulting in:
- Higher volume of paste release
- More uniform shape on solder deposits
- Higher transfer efficiency and print yields
- Greater yields on low-area-ratio/miniaturized applications
- Reduced underside wiping
- Reduced surface energy of the paste contact area
- Better contour definition and lower failure.