Fast. Reliable. Precise.
Laser Cut Solder Stencils Order Now
StenTech SMT stencils are the gold standard in surface mount technology, engineered for precision, built for reliability, and trusted for even the most complex designs.
Crafted with advanced laser technology, our in-house stencils ensure exceptional aperture definition, print quality, and solder paste release, with tight dimensional and positional tolerances down to ±2 µm. We support pitch sizes as fine as 0.3mm and circular pad cutting down to 30 µm, delivering near-perfect roundness and consistency. Our stencils are available in standard thicknesses from 2 mil to 12 mil, with additional thickness options available upon request. Frame sizes range from 5"×5" to 29"×71", and custom frames can be produced with limited capabilities.
With local manufacturing sites across North America, we offer rapid turnaround and consistent quality across every order. All stencils are backed by expert engineering support to help you achieve flawless solder paste deposition and printing results tailored to your specific application.
Technical Information
- Can be shipped the same day if approval is received by 2pm
- Positional accuracy: 0.0004”,
- Dimensional accuracy of +/- 0.0003”
- Available thickness: 2 mil to 12 mil standard, other thickness is available upon request.
- Available frame size: Standard frame size from 5x5 to 29x71 inch.
- Custom frames are available with limited capabilities.
- Full CAD / engineering design support.
Area Ratio Calculator
Quickly determine optimal stencil design with StenTech’s SMT Area Ratio Calculator, ensuring reliable solder paste release for even the smallest apertures.
VIEWCoating Technology
StenTech offers exclusive advanced SMT stencil coatings that deliver unmatched release, print precision, and industry-leading performance for even the most demanding applications.
VIEWResources
Access valuable StenTech resources, including our Area Ratio Calculator, expert Engineering Design Services, and Knowledge Bank with white papers, videos, and presentations.
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