- Durable, thermally cured polymer coating
- Reduces cleaning and boosts paste transfer efficiency
- Increases printed paste volume for consistent results
- Chemically resistant, non-toxic
- RoHS/REACH compliant
- Bonds securely, visible on stencil, and easy to use
- Higher yields and reduced rework lower production costs
- Longer stencil life and less downtime
- Improved overall efficiency
Trusted stencil coating for consistent, high-yield SMT production
The Gold Standard in Stencil
Coating.
StenTech is proud to be the exclusive licensee in the U.S. and Canada of NanoSlic® Gold—the most popular and proven coated stencil on the market. More than just a coating, NanoSlic Gold was developed in collaboration with industry leaders and rigorously validated in our advanced SMT testing labs, ensuring every stencil performs reliably in even the most demanding production environments.
NanoSlic Gold is a thermally cured, durable polymer stencil coating engineered to minimize underside cleaning and improve transfer efficiency. Its thicker, multi-micron formulation slightly reduces aperture dimensions while increasing printed paste volume, delivering more consistent solder deposition. The coating bonds securely to the stencil, is chemically inert, non-toxic, and compatible with most cleaning chemistries—though high-pH cleaners should be avoided. It integrates seamlessly into flux residue, is fully RoHS, RoHS2, and REACH compliant, and is visibly identifiable on the stencil for easy verification. While it cannot be reapplied once coated, applying NanoSlic Gold to a freshly cut and cleaned stencil ensures optimal performance, with only a minimal one-day increase in lead time.
Backed by StenTech’s expertise in stencil design and manufacturing, NanoSlic® Gold delivers higher yields, longer stencil life, and reduced downtime. It’s the trusted choice for manufacturers seeking efficiency, precision, and performance without compromise.
Surface & Apature Functions
Solder application
Reduces solder buildup for cleaner stencils and smoother production.
Solder brick profiles
Helps achieve smoother, more consistent solder brick profiles.
Underside cleaning
Minimizes underside solder buildup, reducing cleaning time.
Transfer efficiency
Boosts transfer efficiency for higher yield and consistent results.
Less bridging
Lowers the risk of solder bridging for cleaner, more reliable prints.
Paste Release
Enhances paste release for more efficient printing.
Upgrade Your Process: Fast, Reliable, Efficient Stencil Coating
Using NanoSlic Gold® enhances productivity and efficiency by improving solder paste transfer, reducing cleaning and rework, and extending stencil life. Its durable, chemically resistant coating lowers the risk of defects and downtime, while being easy to verify and fully compliant with industry standards, helping manufacturers achieve consistent, high-quality results with less effort and greater reliability.
VIEW WHITE PAPERS
